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Epoxy Resin
Molecular formula/Structural formula:C21H25ClO5
Properties:High mechanical properties.Epoxy resin has a strong cohesion, the compact structure of molecules, so its mechanical properties is higher than phenolic resin and general-purpose thermosetting resins such as unsaturated polyester.
Application:Good dielectric properties, set the little shrinkage, dimension stability, high hardness, good flexibility, the alkali solvent and most stable, and therefore is widely used in national defense, national economy departments, pouring, impregnation, laminated materials, adhesives, coatings and other purposes.
Storage and transportation:
25 kg plastic drum.
1. A variety of forms.
2. Convenient curing.Choose a variety of different curing agent, epoxy resin system can almost cured at 0 ~ 180 ¡æ temperature range.
3. Strong adhesive force.Epoxy resin molecular chain in the existence of the inherent polar hydroxyl and ether bond, make its have the very high adhesion strength of various substances.During the curing reaction of epoxy resin of low contractility, produced by the internal stress is small, it also helps to improve the adhesion strength.